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TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG supports the development of FPGA design in any kind of products that require image processing. Furthermore, TED also provides turnkey solutions cooperatively with IP partners and a wide variety of optional boards, in addition to the evaluation board.
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Notice : Device Configuration from the Integrated Flash memory (XC3S1400AN) TB-3S-1400AN-IMG does not support device configuration from the integrated flash memory that is Spartan-3AN FPGA feature,but only from PROM on the board.Please contact us about how to use the integrated flash memory.
Notice for the on-board flash memory :
The board has miss connection between FPGA and flash memory.
We checked the flash memory is working when modified the connection.
If flash memory is requirement for your application.
Please contact us about this solution.
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FPGA:Xilinx XC3S1400AN/XC3SD3400A-4FGG676C |
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Interfaces
-VGA out
-Touch Panel I/F
-Ethernet(10/100/1000) x2 |
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Memory
-32M x 16bit (512Mbits) DDR2 SDRAM x4
-Flash memory 8M x 8bit (64Mbits) |
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Power Supply
LTC Power Management Solution
-LTC1778
-LTC3416
-LTC3026
-LTC3413 |
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Others
-Connector for touch panels, VGA output
-Expansion ports for optional board x2 |
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Reference Design
-DDR2 SDRAM frame buffer design (Verilog HDL)
-Graphic controller (VHDL) |
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| Part number |
TB-3S-1400AN-IMG/TB-3S-3400DSP-IMG |
| Deliverables |
AC Adapter
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<Export Requirements>
Tokyo Electron Device Limited, software programs, technical data and
products may not be exported or re-exported, either directly or indirectly,
to the U.S. embargoed destinations or entities of Cuba, Iran, Iraq,
Libya, North Korea, Serbia/Montenegro, Sudan, Syria and the UNITA
faction in Angola, or to individuals on the Entity List, Denied Persons
List and the Specially Designated Nationals List without prior written
authorization from the U.S. Department of Commerce, Bureau of Export
Administration. |
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