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The inrevium TB-6V-LX760-LSI incorporates a Virtex-6 LX760 FPGA which features maximum density, high speed internal logic and high bandwidth interface. These features allow the TB-6V-LX760-LSI to combine higher bandwidth and performance with lower power consumption. With high-speed memory (DDR3 SDRAM 1066 Mbps) and a USB interface included as standard features together with support for a DDR memory controller and the standard DDR PHY interface (DFI), the new TB-6V-LX760-LSI is an ideal test platform for developing the LSIs that will serve as the core device in products featuring the next generation of high-quality image processing engines or video and communications control engines.
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FPGA
Xilinx FPGA: XC6VLX760-2FFG1760 device |
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Memory
4× DDR3 SDRAM 1Gbit
SPI flash 256 Mbit |
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Others
−Configuration:
Configuration from SD card
−Interfaces
USB 2.0
UART
I2C
−Option connectors: FMC x 10
FMC LPC (low pin count) connectors x 10
(Note: Not all of the LPC pins connect to the FPGA.)
(Note: RoketIO is not connected.)
−Push-button switches x 4
−LED x 16
−DIPO switches x 8
−Power supply |
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Reference designs (Verilog HDL)
−High-speed DDR3 SDRAM interface design
−DVI Frame buffer Designn |
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| Part number |
TB-6V-LX760-LSI |
| Deliverables |
-AC Adapter
-Hardware User Guide
-Schematic
-Reference Design
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<Export Requirements>
Tokyo Electron Device Limited, software programs, technical data and
products may not be exported or re-exported, either directly or indirectly,
to the U.S. embargoed destinations or entities of Cuba, Iran, Iraq,
Libya, North Korea, Serbia/Montenegro, Sudan, Syria and the UNITA
faction in Angola, or to individuals on the Entity List, Denied Persons
List and the Specially Designated Nationals List without prior written
authorization from the U.S. Department of Commerce, Bureau of Export
Administration. |
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