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This board is an evaluation platform which is equipped with High-density, High-performance Virtex-5 LX110/330, DDR2 SDRAM chip and DDR2 SO-DIMM socket. It enables design engineers to rapidly evaluate high-speed interface technologies such as DDR2-SDRAM and LVDS. This is suitable to evaluate various kinds of applications combined with option modules such as DVI, Camera Link, Optical Link and USB.
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Xilinx Virtex-5: XC5LX110/330-FF1760 |
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ELPIDA 512Mbit DDR2-SDRAM chip (667Mbps,
32Mbitx16) x3pcs |
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DDR2 SO-DIMM socket x1 |
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Inrevium FPGA configuration controller
(TE7725PF) |
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SMSC single-chip 10/100 Ethernet
controller (LAN9118) |
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RS-232C |
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Agilent Technology: Soft Touch
Probe x5 |
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LVDS high-speed interfaces x2
(Samtec) |
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Power Supply
LTC Power Management Solution
-LTC1348
-LTC3413
-LTC3728L
-LTM4600
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Available option board: DVI,
Camera Link, Optical Link and USB |
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Reference design of high-speed
DDR2-SDRAM memory interface |
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DDR2 SDRAM PHY Design(Verilog HDL) for Virtex-5
Combining DDR2 SDRAM PHY,Denali's memory controller design IP
"Databahn"featuring technology proven in LSI implementation and inrevium's "Virtex-5 Multi-Application Evaluation Platform
(TB-5V-LX110/330-DDR2), "developers can effectively improve the time-to-market cycle.
For more information about "DDR2 SDRAM PHY Design"
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| Part number |
TB-5V-LX110/330-DDR2 |
| Deliverables |
- Hardware User Guide
- Schematic
- 533Mbps DDR2 I/F Reference Design (VerilogHDL)
- DDR2 + DVI I/F Reference Design (VerilogHDL)
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authorization from the U.S. Department of Commerce, Bureau of Export
Administration. |
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